Product Category
Mask, also known as photomask, takes high purity glass substrate as the substrate, transfers circuit graphics to the substrate by using lithography technology to form IC pattern templates.
The main steps include writing, process, measurement, Inspection, Repair, Clean&Mount.
Photomasks with patterns created from pure Cr-based light-blocking elements can only serve as transparent or opaque masks, and are the the most commonly found category in the market today.
OMOG
Opaque MoSi on Glass
Those that utilize MoSi as an absorption layer are able to provide sufficient optical density, remaining opaque for incoming light rays with wavelengths <193nm. The MoSi layer can also be made thinner to reduce the electromagnetic field effect of the immersion lithography machine. Alternatively, OMOG makes a suitable solution for high-order photolithography.
By transforming phases and transmittance of lights, it improves the resolution and depth of focus of wafers during their exposure, making them better options when buying for higher optical resolution capability.
